packaging technology

Features and Development on Tamper-Evident Packaging Technology

显窃启包装技术的特点及开发

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New packaging technology for keeping fresh of the vegetables and fruits

蔬菜水果保鲜包装新技术

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Packaging Technology for Fresh fruit and Vegetable and Its Research Progress in Modern Logistics

现代物流中果蔬保鲜包装技术及其研究进展

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Modified atmosphere packaging is a new packaging technology which excels the traditional vacuum packaging and high temperature sterilization packaging.

气调保鲜包装是针对真空包装和高温灭菌等传统包装方法带来的不足而研发的新型包装技术。

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With the development of IC packaging technology, flip chip is widely used.

随着集成电路封装技术的发展, 倒装芯片技术得到广泛的应用.

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The microelectronics packaging technology is developed to be thinner and smaller with the new technique of stacked chip package, while it also brings the challenge of low-loop for the thermosonic wire bonding process.

叠层封装技术满足了微电子封装向轻薄小发展的趋势，同时热超声键合技术的低弧大跨度带来了新的挑战。

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The Ditto Cause and Fresh-keeping and Packaging Technology Research of Fresh Cut Flower

鲜切花凋萎的原因及其保鲜包装技术研究

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This paper presents all kinds of microsystem packaging technology which have appeared since the nineties of the 20th century.

介绍了20世纪90年代以来出现的几种微型封装技术。

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Packaging Technology of Infrared Detector on Satellite And Its Application

星用红外探测器封装技术及其应用

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An Investigation of Reactive Ion Etching for Through Silicon Via Packaging Technology

反应离子刻蚀在穿透硅通孔封装技术中的应用研究

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New Progress of Electronic Packaging Technology

电子封装技术的新进展

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A collection of intelligent packaging technology is pluralistic knowledge base of emerging technologies in the branch.

智能型包装技术是集合了多元知识基础的新兴技术分支.

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Along with the development of modern design and packaging technology, external test can't meet the needs.

随着现代设计和封装技术的发展，外部测试变的越来越不适应。

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Increasing the cost of aseptic packaging technology for real-world applications presented a challenge.

成本的提高对于无菌包装技术的实际应用是个挑战.

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The mechanism of food preservation and the characteristics of intelligent packaging technology were analyzed.

智能包装可以更好的对食品起到保鲜作用,已成为包装界关注的焦点.

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Chip scale package ( CSP) is a new microelectronic packaging technology rapidly deve-loped in recent years.

芯片尺度封装（CSP）技术是近年来发展最为迅速的微电子封装新技术。

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The rapid development of electronic packaging technology has led to strict requirement for packaging materials.

电子封装技术的快速发展对封装材料的性能提出了更为严格的要求.

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Study of Fiber Bragg Grating Packaging Technology on Temperature Sensitivity and Temperature Compensation

光纤光栅温敏与温度补偿式封装技术的研究

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Shanghai E-Er Tete packaging technology investment and production in 2000.

上海鄂尔特特包装技术公司于2000年投资生产.

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With development and updating of synthesis and packaging technology, organic luminescent materials are interruptedly used in the field of electroluminescence.

随着合成与组装技术的发展与更新，有机发光材料也不断被应用到电致发光领域中。

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Influence of Military Packaging Technology Development on Military Logistics Effect of Integration on Armyman Suicide

军用包装技术的发展对军事物流的影响综合干预对某部军事人员自杀的影响

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With the development of electronic packaging technology, packaging pin number increasing, lead spacing smaller, encapsulated in the substrate of the area will be smaller.

随着电子封装技术的发展，封装引脚数越来越多，引线间距越来越小，封装体在基板上所占的面积也会更小。

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The New Evolution of Consumer Electronics and Application of Packaging Technology

消费电子产品发展趋势及封装技术的应用

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The conversion to lead free is the trend in electronic packaging technology.

电子产品向无铅化转变是大势所趋。

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Research on the transfusion solution packaging technology

输液包装技术研究

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